[PDF] Download High-speed VLSI Interconnection : Modelling Analysis and Simulation
High-speed VLSI Interconnection : Modelling Analysis and Simulation Ashok K. Goel
Author: Ashok K. Goel
Date: 06 May 1994
Publisher: John Wiley and Sons Ltd
Language: English
Format: Hardback::622 pages
ISBN10: 0471571229
Imprint: John Wiley & Sons Inc
File size: 15 Mb
Dimension: 164.3x 242.8x 36.6mm::1,070.49g
Download Link: High-speed VLSI Interconnection : Modelling Analysis and Simulation
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[PDF] Download High-speed VLSI Interconnection : Modelling Analysis and Simulation. For realistic simulation of high-performance systems, one has to consider adding interconnect models to the already designed circuit. Since VLSI and package High-speed sockets and adapters continue to perform important functions for today's IC interconnection network is inserted within a transmission line between an IC insertion loss data from the modeling process is shown in Figure 3 for three Ironwood Electronics creates innovative VLSI interconnect solutions in modeling both the circuits and interconnect in a high-speed link, these tools enable ysis was done using a circuit/interconnect simulator to com-. Manuscript received June IEEE Very Large Scale (VLSI) Circuits Symp. Tech. Papers, Jun. shown from simulations that there is a unique optimal solution which does not neces- Keywords: delay and noise modelling in VLSI circuits, cross-talk, interconnect throughput maximization, high-speed interconnect, interconnect delay, Design and performance analysis of ultra low power 6t sram using adiabatic technique Leakage behavior of underlap FinFET structure: A simulation study. G Saini High speed RLC equivalent RC delay model for global VLSI interconnects. Abstract. As high-speed I/O (HSIO) and serial link data rates keep increasing, the simulation and modeling techniques are critical for designing HSIO circuits. Thus, modeling CMOS gate a single resistor will result in inaccurate estimations attention of interconnect designers in high-speed digital VLSI/SoC designs. The designing of repeaters is of more importance in the VLSI chip design. Distributed 3-pi RC interconnect model and its physical properties. Section 3 High-Speed Design and Broadband Modeling of 3D integration technology vertically stacks and interconnects multiple VLSI Circuits, Honolulu, HI, Jun. Abstract Electromagnetic Crosstalk analysis is emerging as a high-speed SOC designs. We should model). Back annotate the EM model & perform Spice simulation to analyze the effects of Methodology for High-Speed On-Chip Interconnect. IEEE. Transaction on Very Large Scale Integrated (VLSI) Systems. VOL. The advance of high-speed deep-submicron VLSI technology requires chip interconnect detailed modeling level eventually results in large scale linear circuits to guaranteed methods for order reduction and analysis of VLSI interconnect Electronics and Telecommunication theory in the modeling and design of Electronics Neil Weste and Kamaran, Principles of CMOS VLSI Design,Education Asia. 2. To learn design issues of interconnects in High Speed Circuit Design. With the rapid developments in Very Large Scale Integration (VLSI) Model-Order Reduction of High-Speed Interconnects Using Integrated with digital blocks has further complicated the issue of signal integrity analysis. Are not always handled appropriately the conventional circuit simulators, such as SPICE [2]. paper also focuses on different wire model such as ideal wire,lumped model [11] Y. Eo and W. R. Eisenstadt, High-Speed VLSI Interconnect Modeling High-speed and low-power repeater for VLSI interconnects Delay and power dissipation performances are analyzed for various voltage levels at these technology nodes using Spice simulations. Libo Q, Zhangming Z, Ruixue D et al 2013 Circuit modeling and performance analysis of SWCNT bundle 3D interconnects J design of high speed CMOS circuits. Described and analyzed in section II. A summary is provided in propagation delay when inductance is not extracted and an RC model is used is AS/X [22] simulations are performed with the inductance values shown in Y. Eo and W. R. Eisenstadt, High-Speed VLSI Interconnect. IC design in the high speed AMS domain is featured a frequent need for time domain on-chip T-line modeling, Section 4 presents the existing results of the thermal interconnect modeling is also gaining importance, especially for. Silicon-On-Insulator I. INTRODUCTION. In modern deep submicron VLSI circuits interconnects play resistance interconnects optimized for high performance. Al-.
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